Cita APA (7a ed.)
Monroe, D. (2018). Electronics Are Leaving the Plane: Stacking chips and connecting them vertically increases both speed and functionality. Communications of the ACM, 61(8), 17-19.
Cita Chicago Style (17a ed.)
Monroe, Don. "Electronics Are Leaving the Plane: Stacking Chips and Connecting Them Vertically Increases Both Speed and Functionality." Communications of the ACM 61, no. 8 (2018): 17-19.
Cita MLA (9a ed.)
Monroe, Don. "Electronics Are Leaving the Plane: Stacking Chips and Connecting Them Vertically Increases Both Speed and Functionality." Communications of the ACM, vol. 61, no. 8, 2018, pp. 17-19.
Precaución: Estas citas no son 100% exactas.