One-Step Multicomponent Encapsulation by Compound-Fluidic Electrospray.

The article reports on a compound-fluidic electrospray method that could one-step enclose multiple components into a single microcapsule without contact. It mentions that the general technique involved could be readily extended to produce diverse microcapsules with many other functional materials. I...

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Detalles Bibliográficos

Publicado en:	Journal of the American Chemical Society Vol. 130; no. 25; pp. 7800 - 7802
Autores principales:	Hongyan Chen, Yong Zhao, Yanlin Song, Lei Jiang
Formato:	Artículo
Publicado:	American Chemical Society 6/25/2008
Materias:	Microencapsulation Electrospray ionization mass spectrometry Mass spectrometry Microreactors Chemical reactors
Acceso en línea:	Ver este registro en EBSCOhost