An Occupational Exposure Assessment for Engineered Nanoparticles Used in Semiconductor Fabrication.
Engineered nanoparticles of alumina, amorphous silica, and ceria are used in semiconductor device fabrication during wafer polishing steps referred to as ‘chemical mechanical planarization’ (CMP). Some metal oxide nanoparticles can impact the biological response of cells and organ systems and may ca...
| Publicado en: | Annals of Occupational Hygiene Vol. 58; no. 2; pp. 251 - 266 |
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| Autores principales: | , |
| Formato: | research tables/charts Journal Article |
| Publicado: |
Oxford University Press / USA
Mar2014
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| Acceso en línea: | Ver este registro en EBSCOhost |