Identifying the Hazard Characteristics of Powder Byproducts Generated from Semiconductor Fabrication Processes.

Semiconductor manufacturing processes generate powder particles as byproducts which potentially could affect workers’ health. The chemical composition, size, shape, and crystal structure of these powder particles were investigated by scanning electron microscopy equipped with an energy dispersive sp...

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Publicado en:Journal of Occupational & Environmental Hygiene Vol. 12; no. 2; pp. 114 - 123
Autores principales: Choi, Kwang-Min, An, Hee-Chul, Kim, Kwan-Sick
Formato: pictorial research tables/charts Journal Article
Publicado: Taylor & Francis Ltd Feb2015
Acceso en línea:Ver este registro en EBSCOhost
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      dt: Feb2015
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      pub: Taylor & Francis Ltd
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        atl: Identifying the Hazard Characteristics of Powder Byproducts Generated from Semiconductor Fabrication Processes.
      aug:
        au:
          Choi, Kwang-Min
          An, Hee-Chul
          Kim, Kwan-Sick
        affil: Samsung Health Research Institute, Samsung Electronics, Yongin-City, Gyeonggi-Do, Korea
      sug:
        subj:
          Manufacturing Industry
          Particulate Matter
          Occupational Exposure
          In Vitro Studies
          Aerosols Analysis
          Powders Analysis
          South Korea
          Spectrophotometry, Infrared
          Microscopy, Electron
      ab: Semiconductor manufacturing processes generate powder particles as byproducts which potentially could affect workers’ health. The chemical composition, size, shape, and crystal structure of these powder particles were investigated by scanning electron microscopy equipped with an energy dispersive spectrometer, Fourier transform infrared spectrometry, and X-ray diffractometry. The powders generated in diffusion and chemical mechanical polishing processes were amorphous silica. The particles in the chemical vapor deposition (CVD) and etch processes were TiO2and Al2O3, and Al2O3particles, respectively. As for metallization, WO3, TiO2,and Al2O3particles were generated from equipment used for tungsten and barrier metal (TiN) operations. In photolithography, the size and shape of the powder particles showed 1–10 μm and were of spherical shape. In addition, the powders generated from high-current and medium-current processes for ion implantation included arsenic (As), whereas the high-energy process did not include As. For all samples collected using a personal air sampler during preventive maintenance of process equipment, the mass concentrations of total airborne particles were < 1 μg, which is the detection limit of the microbalance. In addition, the mean mass concentrations of airborne PM10(particles less than 10 μm in diameter) using direct-reading aerosol monitor by area sampling were between 0.00 and 0.02 μg/m3. Although the exposure concentration of airborne particles during preventive maintenance is extremely low, it is necessary to make continuous improvements to the process and work environment, because the influence of chronic low-level exposure cannot be excluded.
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    language: English
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