Electronics Are Leaving the Plane: Stacking chips and connecting them vertically increases both speed and functionality.
The article discusses the assembling the components of integrated circuits vertically on semiconductor three-dimensional 3D) chips (or stacking chips), including its role in improving computer performance and speed. An overview of high-bandwidth memory (HBM), including its memory in comparison with...
| Publicado en: | Communications of the ACM Vol. 61; no. 8; pp. 17 - 19 |
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| Formato: | Artículo |
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Association for Computing Machinery
Aug2018
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| Acceso en línea: | Ver este registro en EBSCOhost |
| Sumario: | The article discusses the assembling the components of integrated circuits vertically on semiconductor three-dimensional 3D) chips (or stacking chips), including its role in improving computer performance and speed. An overview of high-bandwidth memory (HBM), including its memory in comparison with graphics processor units (GPUs), is provided. |
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