Nanoparticle Engineering for Chemical-Mechanical Planarization : Fabrication of Next-Generation Nanodevices
In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progres...
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| Formato: | Libro |
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CRC Press
2019
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| Acceso en línea: | Ver este registro en EBSCOhost |
| fields | @attributes: recordID: 1 pdfLink: plink: https://search.ebscohost.com/login.aspx?direct=true&db=nlebk&AN=2154066&site=ehost-live header: @attributes: shortDbName: nlebk uiTerm: 2154066 longDbName: eBook Collection (EBSCOhost) uiTag: AN controlInfo: bkinfo: btl: Nanoparticle Engineering for Chemical-Mechanical Planarization : Fabrication of Next-Generation Nanodevices aug: au: Ungyu Paik Jea-Gun Park isbn: 9780367446062 9781420059113 9780429291890 9781000023220 9781000023367 imageinfo: pubinfo: dt: @attributes: year: 2019 month: 01 day: 01 dtAvail: @attributes: year: 2021 month: 10 day: 11 pub: CRC Press pubContract: CRC Press (Unlimited) place: [Place of publication not identified] price: 0.01 limitsGroup: maxCheckoutDays: 1500 copyPages: -1 pda: N printPagesOffline: 60 printPagesOnline: 60 previewPages: 10000 prePubGroup: dewey: @attributes: class: 621.38152 item: 621 .38152 lc: @attributes: class: TK7874.84 item: TK 7874 .84 artinfo: ui: 2154066 1104036011 formats: fmt: – @attributes: type: EB doid: NL$2154066$PDF caption: PDF download: Y – @attributes: type: EK doid: NL$2154066$EPUB caption: EPUB download: Y tig: atl: Nanoparticle Engineering for Chemical-Mechanical Planarization : Fabrication of Next-Generation Nanodevices ptl: Nanoparticle Engineering for Chemical-Mechanical Planarization aug: au: Ungyu Paik Jea-Gun Park su: Nanoparticles Chemical mechanical planarization Nanoelectronics sug: subj: TECHNOLOGY & ENGINEERING / Materials Science / Electronic Materials TECHNOLOGY & ENGINEERING / Electronics / Microelectronics TECHNOLOGY & ENGINEERING / Nanotechnology & MEMS Nanoparticles Chemical mechanical planarization Nanoelectronics ab: In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices.Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology.Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems. pubtype: eBook doctype: Book ougenre: Book language: English copyright: @attributes: flag: N copyrightText: holdings: @attributes: islocal: N |
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