Nanoparticle Engineering for Chemical-Mechanical Planarization : Fabrication of Next-Generation Nanodevices

In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progres...

Descripción completa

Detalles Bibliográficos
Autores principales: Ungyu Paik, Jea-Gun Park
Formato: Libro
Publicado: CRC Press 2019
Materias:
Acceso en línea:Ver este registro en EBSCOhost