| Sumario: | This article examines an innovation that IBM researchers have developed that can increase a computer chips' performance or reduce its power consumption. The technology involves the production of airgaps between wires in processors that use self-assembling technology. Daniel C. Edelstein, the project manager, notes that this technology will allow chip makers to continue to produce smaller, more powerful and more energy efficient processors. Edelstein also added that traditional methods for accomplishing these goals, such as shrinking transistors, were becoming more difficult to implement. The article discusses how the technology works and mentions that the companies Sony, Toshiba and Advanced Micro Devices are all partners in the project.
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