IBM Adds "Nothing" to Chips, Improves Performance.

This article examines an innovation that IBM researchers have developed that can increase a computer chips' performance or reduce its power consumption. The technology involves the production of airgaps between wires in processors that use self-assembling technology. Daniel C. Edelstein, the project...

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Publicado en:Computer (00189162) Vol. 40; no. 7; pp. 17 - 18
Formato: Artículo
Publicado: IEEE Jul2007
Materias:
Acceso en línea:Ver este registro en EBSCOhost
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        atl: IBM Adds "Nothing" to Chips, Improves Performance.
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      su:
        Technological innovations
        Integrated circuit design
        Integrated circuits
        Microprocessor design & construction
        Microtechnology
        Energy consumption
        Transistor circuits
        International Business Machines Corp.
        Sony Electronics Inc.
        Toshiba KK
        Advanced Micro Devices Inc.
      sug:
        subj:
          Technological innovations
          Integrated circuit design
          Integrated circuits
          Microprocessor design & construction
          Microtechnology
          Energy consumption
          Transistor circuits
          International Business Machines Corp.
          Sony Electronics Inc.
          Toshiba KK
          Advanced Micro Devices Inc.
      ab: This article examines an innovation that IBM researchers have developed that can increase a computer chips' performance or reduce its power consumption. The technology involves the production of airgaps between wires in processors that use self-assembling technology. Daniel C. Edelstein, the project manager, notes that this technology will allow chip makers to continue to produce smaller, more powerful and more energy efficient processors. Edelstein also added that traditional methods for accomplishing these goals, such as shrinking transistors, were becoming more difficult to implement. The article discusses how the technology works and mentions that the companies Sony, Toshiba and Advanced Micro Devices are all partners in the project.
      pubtype: Academic Journal
      doctype: Article
      src: R
    language: English
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          year: 2007
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