Semiconductor Packaging : Materials Interaction and Reliability

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Detalles Bibliográficos
Autores principales: Andrea Chen, Randy Hsiao-Yu Lo
Formato: Libro
Publicado: CRC Press 2012
Acceso en línea:Ver este registro en EBSCOhost