Semiconductor Packaging : Materials Interaction and Reliability
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
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| Formato: | Libro |
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CRC Press
2012
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| Acceso en línea: | Ver este registro en EBSCOhost |
| fields | @attributes: recordID: 1 pdfLink: plink: https://search.ebscohost.com/login.aspx?direct=true&db=nlebk&AN=389712&site=ehost-live header: @attributes: shortDbName: nlebk uiTerm: 389712 longDbName: eBook Collection (EBSCOhost) uiTag: AN controlInfo: bkinfo: btl: Semiconductor Packaging : Materials Interaction and Reliability aug: au: Andrea Chen Randy Hsiao-Yu Lo isbn: 9781439862056 9781138075405 9781439862070 9781000218619 9780429063350 imageinfo: pubinfo: dt: @attributes: year: 2012 month: 01 day: 01 dtAvail: @attributes: year: 2014 month: 02 day: 04 pub: CRC Press pubContract: CRC Press (Unlimited) place: Boca Raton, Fla price: 0.01 limitsGroup: maxCheckoutDays: 1500 copyPages: -1 pda: N printPagesOffline: 60 printPagesOnline: 60 previewPages: 10000 prePubGroup: dewey: @attributes: class: 621.38152 item: 621 .38152 lc: @attributes: class: TK7870.15 .C54 2012eb item: TK 7870 .15 .C54 2012eb artinfo: ui: 389712 759865955 formats: fmt: – @attributes: type: EB doid: NL$389712$PDF caption: PDF download: Y – @attributes: type: EK doid: NL$389712$EPUB caption: EPUB download: Y tig: atl: Semiconductor Packaging : Materials Interaction and Reliability ptl: Semiconductor Packaging aug: au: Andrea Chen Randy Hsiao-Yu Lo su: Microelectronic packaging sug: subj: TECHNOLOGY & ENGINEERING / Electronics / General TECHNOLOGY & ENGINEERING / Electronics / Circuits / General TECHNOLOGY & ENGINEERING / Electronics / Microelectronics TECHNOLOGY & ENGINEERING / Electronics / Semiconductors TECHNOLOGY & ENGINEERING / Materials Science / General Microelectronic packaging ab: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages. pubtype: eBook doctype: Book ougenre: Book language: English copyright: @attributes: flag: N copyrightText: holdings: @attributes: islocal: N |
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